Performance of Selective Plated Copper Coatings on Stainless Steel 316L and Nickel Alloy Ni201: Microstructure, Microhardness, Wear Resistance, and Corrosion Resistance
DOI:
https://doi.org/10.7546/CRABS.2023.10.12Keywords:
copper coating, selective plating, antibacterial surfaces, mechanical properties, wear resistanceAbstract
This study investigates the properties and performance of selective plated copper coatings on stainless steel 316L and nickel alloy Ni201 substrates, using acidic and alkaline electrolyte solutions. The analysis encompasses surface microstructure, elemental distribution, microhardness, surface roughness, wear resistance, and corrosion resistance of the coatings. The results demonstrate that the selective plated copper coatings exhibit a uniform and continuous deposition, free from visible irregularities or structural imperfections. Notably, the alkaline copper coatings exhibit significantly higher microhardness values compared to the acidic coatings, irrespective of the substrate materials. Surface roughness measurements reveal an increase in roughness after wear testing for all coatings, with the alkaline coatings showing lower initial roughness values and superior wear resistance compared to the acidic coatings. Concerning corrosion resistance, the alkaline copper coatings display a higher susceptibility to corrosion compared to the acidic coatings. Generally, the findings underscore the effectiveness of the selective plating process in producing high-quality, uniform, and defect-free copper coatings on stainless steel and nickel alloy substrates.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2023 Proceedings of the Bulgarian Academy of SciencesCopyright (c) 2022 Proceedings of the Bulgarian Academy of Sciences
Copyright is subject to the protection of the Bulgarian Copyright and Associated Rights Act. The copyright holder of all articles on this site is Proceedings of the Bulgarian Academy of Sciences. If you want to reuse any part of the content, please, contact us.